MULTILAYER ELECTRONIC COMPONENT
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Jul 3, 2024
filing date -
Jul 3, 2024
priority date (Note) -
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Abstract
A multilayer electronic component includes a body including a dielectric layer and an internal electrode layer alternately disposed with the dielectric layer in a first direction, wherein the internal electrode layer includes a main portion, a lead portion extending from the main portion to the external electrode and having a size smaller than the main portion, and a reinforcing pattern disposed on both sides of the lead portion, and the reinforcing pattern includes a carbide.
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