MULTILAYER ELECTRONIC COMPONENT
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Sep 3, 2024
filing date -
Sep 3, 2024
priority date (Note) -
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Abstract
A multilayer electronic component may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; an interface plating layer disposed on an end of the internal electrode; and an external electrode disposed to contact at least a portion of an end of the dielectric layer disposed between the internal electrodes and to cover the interface plating layer, and including a conductive resin layer including a conductive metal and a resin.
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