MULTILAYER CERAMIC CAPACITOR, PACKAGE, AND CIRCUIT BOARD
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Dec 16, 2024
filing date -
Dec 16, 2024
priority date (Note) -
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Abstract
A multilayer ceramic capacitor has a dimension in a first axis direction equal to or greater than 1.5 times a dimension in a second axis direction, and includes a ceramic body and a pair of external electrodes. The external electrodes contain Cu as a main component and cover respective end surfaces. The ceramic body includes a multilayer portion including internal electrodes that contain Ni as a main component, are alternately stacked with ceramic layers along a stacking direction, and are led out to connection ends on the end surfaces, and a pair of margin portions that cover the multilayer portion from a width direction of the internal electrodes, and contain a low-melting-point metal having a lower melting point than Ni. In each of the internal electrodes, a width dimension at the connection end is smaller than at a center in a third axis direction.

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- 15 United States
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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TAIYO YUDEN CO LTD | 7-19 KYOBASHI 2-CHOME CHUO-KU TOKYO 104-0031 |
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
SHIROTA, Ayumi | Tokyo, JP | 1 | 0 |
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