Importance

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Abstract

A semiconductor device includes a semiconductor element, a substrate, a bonding member and a sealing body sealing the semiconductor element, the substrate and the bonding member. The substrate has front-face and back-face metal bodies on opposite faces of an insulating base member. The front-face metal body is electrically connected to a main electrode of the semiconductor element. The bonding member connects the front-face metal body and the main electrode. The front-face metal body includes a base material and a plating film disposed on faces of the base material. The plating film is disposed at an upper face and a side face of the front-face metal body. The front-face metal body includes a roughened portion at the upper face and the side face, and a non-roughened portion at an area of the upper face excluding the roughened portion and including an arrangement region of the bonding member.

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First Claim