DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING
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United States of America
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Apr 10, 2025
app pub date -
Dec 16, 2024
filing date -
Dec 16, 2024
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Abstract
A method includes applying a sintering precursor material layer to each of a first surface and a second surface of a base layer, and assembling a precursor assembly of a substrate by coupling a first electrically conductive layer on the sinter precursor material layer on the first surface of the base layer and a second electrically conductive layer on the second surface of the sinter precursor material layer on a second surface of the base layer such that the base layer is disposed between the first leadframe and the second leadframe. The method further includes sinter bonding the first electrically conductive layer and the second electrically conductive layer to the base layer to form a sinter bonded substrate.
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