SEMICONDUCTOR ARRANGEMENT COMPRISING A SEMICONDUCTOR ELEMENT WITH AT LEAST ONE CONNECTION ELEMENT
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United States of America
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Apr 10, 2025
app pub date -
Jan 12, 2023
filing date -
Jan 12, 2023
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Abstract
A semiconductor arrangement includes a semiconductor element having a connection element, and a metallic contacting element connected flatly to the connection element of the semiconductor element by being sprayed onto the semiconductor element via a thermal spraying method involving atmospheric plasma spraying. The metallic contacting element incudes first and second particles which form a textured layer, with the first particles deformed in a planar-like manner and with the second particles being melted second particles, said first particles being at least five times larger than the second particles.
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