PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Dec 19, 2024
filing date -
Dec 19, 2024
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Abstract
Generally discussed herein are systems, methods, and apparatuses that include conductive pillars that are about co-planar. According to an example, a technique can include growing conductive pillars on respective exposed landing pads of a substrate, situating molding material around and on the grown conductive pillars, removing, simultaneously, a portion of the grown conductive pillars and the molding material to make the grown conductive pillars and the molding material about planar, and electrically coupling a die to the conductive pillars.
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