SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Oct 3, 2024
filing date -
Oct 3, 2024
priority date (Note) -
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Abstract
A semiconductor package includes a package substrate having substrate pads disposed in a middle region and a reference mark disposed at a first corner portion adjacent to a first corner within an edge region surrounding the middle region on a lower surface of the package substrate; at least one semiconductor chip mounted on an upper surface of the package substrate; a sealing member covering the at least one semiconductor chip on the package substrate; an electromagnetic shielding member covering a side surface of the package substrate and an upper surface and a side surface of the sealing member; and at least one barrier protruding downwards from the lower surface of the package substrate and is disposed between the first corner and the reference mark.
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