ELECTROSTATIC CHUCK
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Sep 25, 2024
filing date -
Sep 25, 2024
priority date (Note) -
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Abstract
An electrostatic chuck 10 includes a dielectric substrate 100 in which through-holes 140 are formed, a base plate 200 formed of a metal material, and a bonding layer 300 that bonds the dielectric substrate 100 and the base plate 200. When a Young's modulus of the bonding layer 300 is E (MPa), and a distance between a central axis AX0 of the dielectric substrate 100 and a central axis AX1 of each of the through-holes 140 is X (mm), with respect to the through-holes 140 at a position farthest from the central axis AX0, E≤0.2063×X2−59.3887×X+4278.8065 is established.
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