POWER SWITCH DEVICE, LAYOUT METHOD, AND SYSTEM

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250119143A1
SERIAL NO

18484124

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Abstract

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An IC device includes a first interconnect structure configured to distribute a power supply voltage, a second interconnect structure configured to distribute a reference voltage, a third interconnect structure configured to distribute a first power gating signal, and a plurality of logic circuits. Each logic circuit of the plurality of logic circuits includes a power switch coupled in series with a logic gate between the first and second interconnect structures, and the power switch includes a control terminal coupled to the third interconnect structure.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LIU, Jack Hsinchu, TW 127 918

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