PRINTED CIRCUIT BOARD
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Jul 18, 2024
filing date -
Jul 18, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board includes a substrate; first and second through-portions penetrating between upper and lower surfaces of the substrate; a magnetic layer disposed in the first through-portion; a voltage regulator disposed in the second through-portion; a first through-hole penetrating between upper and lower surfaces of the magnetic layer; a first insulating layer disposed on the substrate, covering the magnetic layer and the voltage regulator, and filling the second through-portion and the first through-hole; a second through-hole penetrating between upper and lower surfaces of the first insulating layer in the first through-hole; a first wiring pattern disposed on an upper surface of the magnetic layer; a second wiring pattern disposed on a lower surface of the magnetic layer; and a first via pattern disposed in the second through-hole and connecting the first and second wiring patterns to each other.
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