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Abstract

A wiring board includes a layered structure and a waveguide. The layered structure include multiple insulating layers that are laminated. The waveguide is formed inside the layered structure. The waveguide includes a pair of conductive layers, and multiple conductive pillars. The pair of the conductive layers face each other in a lamination direction of the insulating layers. The multiple conductive pillars are arranged in two rows along a propagation direction of electromagnetic waves between the pair of the conductive layers, and connects the pair of the conductive layers. The respective conductive pillars include multiple connection pads and a via. The connection pads are laminated between the pair of the conductive layers. The via connects the connection pads of adjacent layers, and has a cross-section perpendicular to the lamination direction in a rectangular shape.

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First Claim