ELECTRONIC ELEMENT ASSEMBLY, IMAGE SENSOR MODULE, CAMERA MODULE AND ELECTRONIC DEVICE
Number of patents in Portfolio can not be more than 2000
United States of America
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N/A
Issued Date -
Apr 10, 2025
app pub date -
Sep 27, 2024
filing date -
Sep 27, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An electronic element assembly includes a first electronic element, an electronic element board and a flexible circuit. The first electronic element is disposed on the electronic element board, and the electronic element board includes a first circuit and a second circuit, wherein the first circuit and the second circuit are disposed on relative sides of the first electronic element, respectively. The flexible circuit is disposed on the electronic element board, and the flexible circuit includes a connecting portion, a bending portion and an electronic path. The connecting portion is connected to the electronic element board. The bending portion is disposed on a side of the connecting portion away from the first electronic element. At least one portion of the electronic path is disposed on the bending portion.
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