WIRING BOARD
Number of patents in Portfolio can not be more than 2000
United States of America
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N/A
Issued Date -
Apr 10, 2025
app pub date -
Dec 22, 2022
filing date -
Dec 22, 2022
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
This wiring board has an insulating layer. a via conductor, and a conductor layer. The insulating layer is made of glass ceramics. The via conductor is arranged to penetrate the insulating layer. The conductor layer is positioned along the surface of the insulating layer. The via conductor and conductor layer are connected, and both are sintered bodies of a plurality of metal particles containing copper as a main component. The average particle size of the metal particles in the via conductor is larger than the average particle size of the metal particles in the conductor layer. The via conductor and conductor layer viewed in cross section contain a metal component at 70% or more per unit area.
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