Thin film pattern generation by an inverse self-lifting technique
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United States of America Patent
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Jan 1, 1980
Grant Date -
N/A
app pub date -
Nov 21, 1978
filing date -
Nov 21, 1978
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of pattern generating a circuit film and adjacent barrier film on a substrate. A continuous layer of circuit film is applied to the substrate surface, and a photoresist pattern is delineated on the circuit film such that the photoresist remains on the circuit film pattern area. The area of circuit film not covered by photoresist is then removed, exposing the substrate surface. While retaining the photoresist which covers the circuit film pattern, the entire substrate surface is coated with the barrier film. The remaining photoresist is then removed, causing the barrier film which covers it to lift off, thereby exposing the circuit film pattern.
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