Implantable temperature probe
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United States of America Patent
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-
Jan 8, 1980
Grant Date -
N/A
app pub date -
May 31, 1977
filing date -
May 31, 1977
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A temperature probe that does not perturb incident electromagnetic fields which includes a high resistance thermocouple mounted within a rigid needle structure. Special leads connect the thermocouple to appropriate metering means to register the temperature sensed by the thermocouple.
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