Process for multiple lap cutting of solid materials

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United States of America Patent

PATENT NO 4187827
SERIAL NO

05902514

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Abstract

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A process for the multiple lap cutting of solid materials, using a set of parallel, spaced apart blades mounted on the frame of a gang-saw for reciprocal movement over the solid materials to be cut, in a suspension of a lapping abrasive, wherein a pressure of from 100 to 1,000 gf per blade is exerted on the solid material, the free working length of the blades is held between 110 to 250 mm, and wherein the pressure applied to the blades is inversely proportional to the length of the blades, and the blades move through the solid material at a mean lateral speed of from 30 to 150 meters per minute.

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Patent Owner(s)

  • WACKER-CHEMITRONIC GESELLSCHAFT FUR ELEKTRONIK-GRUNDSTOFFE MBH

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Moritz, Alfred Burghausen, DE 5 53
Regler, Dieter Burghausen, DE 6 57
Sitrl, Erhard Marktl, DE 1 4

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