Installation of a semiconductor chip on a glass substrate
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United States of America Patent
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-
Feb 26, 1980
Grant Date -
N/A
app pub date -
Aug 10, 1977
filing date -
Aug 11, 1976
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A flipchip LSI is mounted on a glass substrate through the use of bonding techniques. An insulating layer made of, for example, epoxy resin is formed between the LSI chip and the glass substrate in such a manner that the insulating layer is fixed to both of the LSI chip and the glass substrate. The insulating layer functions to absorb strain caused by differences of the coefficient of thermal expansion of the LSI chip and the glass substrate, thereby securing stable operation of the LSI chip.
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