Importance

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Abstract

A socket insertion guide for an encapsulated electronics package having pins oriented to be inserted into socket contacts in substantially a single direction is disclosed. The socket insertion guide includes a pair of longitudinal placement guides and a pair of lateral placement guides. The guides extend beyond the distal ends of the pins and guide the movement of the encapsulated electronics package toward the socket so that the pins are inserted into the socket contacts. The guide also includes a means for orienting the proximal ends of the pins for proper insertion of the distal ends of the pins into the socket contacts. An arrangement of the socket insertion guide for dual in-line packages includes a housing with walls for the sides and ends of the package, the walls extending from beyond the distal ends of the pins in one direction to beyond the dual in-line package body in the other direction, where the inner faces of the walls serve to align the pins of the dual in-line package with the socket contacts when the housing is placed over the socket. A stop extending from the inside face of each end wall fixes the position of the dual in-line package. The socket insertion guide also includes a channel for placement in the housing over the top of the dual in-line package, aligning the proximal ends of the pins on each side of the dual in-line package.

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First Claim