Process for preparing a film of densely packed structure
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United States of America Patent
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-
Jun 24, 1980
Issued Date -
N/A
app pub date -
Jan 23, 1978
filing date -
Aug 20, 1975
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for preparing dielectric or semiconductive films which have densely packed structures. In a process comprising spreading a powdery ceramic material suspended in a binder and solvent on to a base plate to form a thin layer and subjecting the layer to firing, the improvement being provisionally firing the thin layer to remove the binder and solvent, cooling the resulting thin layer, covering the thin layer with an organic film, compressing the thin layer and the film to densely pack the thin layer and to adhere the thin layer to the film, prior to the firing.
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