Semiconductor mounting producing efficient heat dissipation
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United States of America Patent
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-
Jun 24, 1980
Grant Date -
N/A
app pub date -
Aug 24, 1977
filing date -
Aug 28, 1976
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In order to efficiently dissipate heat from both sides of a semiconductor vice to an associated cooling element, the device is contacted at its two load current conducting sides by conductive contacting elements and the contacting elements are both firmly connected to the cooling element in a thermally conductive and electrically insulating manner.
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