Importance

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Abstract

A solid state laser rod and a mount through which heat is dissipated from the rod are joined together at a bond comprised of a reflective layer on the surface of the rod, a barrier layer over the reflective layer, and a solder layer between the barrier layer and the mount. The reflective layer may be applied by sputter or other deposition procedures and is highly reflective in the region of the spectrum at which the laser operates, thus insuring optimum efficiency for the rod. The barrier layer may be applied to the reflective layer by the same deposition procedure, and it is impervious to the solder so that the solder does not penetrate it and scavenge the reflective layer. The solder should have a low melting point so as to avoid setting up excessive mechanical stresses in the rod when the solder solidifies. Both the mount and the barrier layer may be covered with a wetting layer prior to soldering to achieve better adhesion of the solder.

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First Claim