Polish formulations
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United States of America Patent
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-
Aug 19, 1980
Grant Date -
N/A
app pub date -
Sep 28, 1978
filing date -
Sep 28, 1978
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Improvement of polish formulations containing a wax and/or an abrasive and optionally at least one member selected from the group consisting of solvents, surfactants, thickening agents, detergent resistant additives, colorants, odorants, and other ingredients normally used in making polishes is disclosed by incorporating in the polish (a) a cyclodimethylsiloxane fluid, (b) a polydiorganosiloxane-polyoxyalkylene copolymer, and (c) water. Further advantages may also be achieved by the incorporation of an organic water-in-oil surfactant having an HLB value of 2-10 and/or certain silicone-glycol copolymers in the polish.
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