US Patent No: 4,222,815

Number of patents in Portfolio can not be more than 2000

Isotropic etching of silicon strain gages

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Abstract

A method of etching a silicon diffused resistance pressure transducer assembly (13) of a transducer (10) mounted on a glass base (14) providing a thin flexible area on the transducer in the region of the diffused resistors (15) and a thick rigid area in the region where the transducer is mounted to the glass base (14). To accomplish this, the transducer (10) is first bonded to the glass base (14) which is tubular, thus providing a circular area on the backside (16) of the transducer (10) open to ambient. This open area is then filled with an isotropic etchant which etches silicon material but which has little effect on glass material. Thus, the region of the diffused resistors (15) is etched out to provide a thin flexible area while leaving a thick area where the transducer (10) is mounted to the glass base (14).

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
ELSAG INTERNATIONAL B.V., A CORP. OF THE NETHERLANDSNEW ORLEANS, LA207

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Krechmery, Roger L Riverside, CA 3 94

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Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
KOPIN CORPORATION (4)
5,095,401 SOI diaphragm sensor 88 1990
5,177,661 SOI diaphgram sensor 31 1992
5,493,470 SOI diaphragm sensor 21 1992
5,490,034 SOI actuators and microsensors 39 1993
 
CHARGE INJECTION TECHNOLOGIES, INC. (2)
5,391,958 Electron beam window devices and methods of making same 25 1993
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MITSUBISHI HEAVY INDUSTRIES, LTD. (2)
5,542,192 Vacuum roll apparatus 3 1993
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DELPHI TECHNOLOGIES, INC. (1)
7,204,162 Capacitive strain gauge 2 2004
 
HEWLETT-PACKARD COMPANY (1)
4,752,505 Pre-metal deposition cleaning for bipolar semiconductors 7 1987
 
RAYTHEON COMPANY (1)
5,049,234 Methods for removing stringers appearing in copper-containing multi-layer printed wiring boards 3 1988