Method and apparatus for testing solderability and de-soldering wicks
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United States of America Patent
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-
Oct 14, 1980
Grant Date -
N/A
app pub date -
Jul 16, 1979
filing date -
Jun 26, 1979
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Apparatus and methods for testing the solderability of metal components and testing de-soldering wicks. The workpiece to be tested is lowered into a molten solder and upon contacting the solder an electrical circuit is completed to commence a timing cycle.
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