System for regulating the applied blade-to-boule force during the slicing of wafers
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United States of America Patent
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-
Oct 21, 1980
Grant Date -
N/A
app pub date -
Sep 8, 1978
filing date -
Sep 8, 1978
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A system for controlling the blade-to-boule feedrate of a wafer cutting saw to regulate the blade-to-boule force in accordance with predetermined criteria and for monitoring the cutting efficiency of the blade and determining when the blade needs to be dressed to increase its cutting efficiency. A constant blade-to-boule force is preferred.
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