Copolyamide resins from piperazine and polyoxyalkylene diamine having improved creep resistance
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United States of America Patent
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Oct 21, 1980
Grant Date -
N/A
app pub date -
Feb 8, 1979
filing date -
Feb 2, 1979
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Copolyamides derived from a mixture of short-chain and long-chain saturated aliphatic dicarboxylic acids, piperazine and a polyoxyalkylene diamine are excellent hot melt adhesives useful with a variety of substrates. These thermoplastic copolyamide resins are particularly useful adhesives for vinyl materials and are resistant to creep.
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