Package for semiconductor devices with first and second metal layers on the substrate of said package
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United States of America Patent
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-
Oct 21, 1980
Grant Date -
N/A
app pub date -
Feb 9, 1979
filing date -
Feb 8, 1978
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A package for sealing an MOS type semiconductor element having a die-attach area comprising a first metal layer composed of gold and a second metal layer composed of a metal having a good bondability to aluminum metal, which is electrically connected to the first metal layer.
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