Method of assembling semiconductor integrated circuit
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United States of America Patent
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-
Dec 9, 1980
Grant Date -
N/A
app pub date -
May 23, 1978
filing date -
Jun 1, 1977
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of assembling a semiconductor integrated circuit in which a semiconductor integrated circuit chip with bumps is bonded to a flexible film circuit substrate. The assembling method of the invention comprises a step of making the highest layer of the bump of solder or a low melting point metal treating the surface of the flexible film circuit substrate by gold-plating, and bonding the semiconductor integrated circuit chip and the flexible film circuit substrate with the former mounted face-down on the latter.
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