Importance

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Abstract

An LSI fabrication process employs pulsed laser energy to selectively tailor individual logic elements of which the building blocks of an LSI array may be configured and to selectively interconnect these laser-configured building blocks. On an LSI chip, an array of universal logic devices or building blocks may be formed together with a matrix pattern of intrablock pathways or signal channels through which the building blocks may be tested and selectively interconnected in order that a prescribed LSI configured system or subsystem may be formed. By selectively directing pulsed laser energy onto prescribed connection regions of the building blocks and onto selected regions of the intrablock pathways, thereby interconnecting and/or disconnecting portions of a conductor matrix pattern relative to the structural components of the various cells, there is obtained a prescribed LSI containing both laser-configured logic devices (building blocks) and laser-configured highways interconnecting the selectively tailored logic devices.

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First Claim