Multilayer printed circuit board
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United States of America Patent
Stats
-
Feb 10, 1981
Grant Date -
N/A
app pub date -
Dec 28, 1978
filing date -
Dec 28, 1978
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A multilayer printed circuit board having a pad pattern formed on each of the layers. When the board is assembled, the layers are releasably secured together. The pads on each layer are aligned and make electrical contact with the pads on adjacent layers to provide interlayer electrical connections.
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Cited Art Landscape
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