Heat bonding device
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United States of America Patent
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-
Feb 17, 1981
Issued Date -
N/A
app pub date -
Sep 6, 1979
filing date -
Sep 6, 1979
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Apparatus for bonding heat bondable materials through the application of pressure and heat employs a diaphragm pressed by fluid pressure against the materials. The diaphragm comprises a web having a flexible heating element bonded to its non-material pressing side and has a configuration corresponding to the desired seam configuration. An improved heating element configuration is disclosed to reduce the forces tending to separate the element from the web as a result of their different coefficients of expansion and provision is made fo facilitate electrical connection to the heating element while reducing unwanted effects on the heat pattern.
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