Forming vias through multilayer circuit boards
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United States of America Patent
Stats
-
Mar 31, 1981
Issued Date -
N/A
app pub date -
Dec 14, 1978
filing date -
Dec 14, 1978
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A via (21) is formed in a multilayer printed circuit board (10) by initially etching apertures (14) in the land areas (13) of the circuit pattern on the layers (11) prior to uniting the layers. A beam (16) of laser energy is then directed through the apertures to form a via through the printed circuit board. Each via is defined by the apertures in a plurality of vertically aligned land areas. The via is then electrolessly plated to provide electrical connections between vertically aligned land areas.
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Cited Art Landscape
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