Flat package for integrated circuit devices
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United States of America Patent
Stats
-
Apr 28, 1981
Grant Date -
N/A
app pub date -
Aug 24, 1979
filing date -
Oct 19, 1978
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
According to the present invention, a flat package for at least one integed circuit device having output pads comprises a supporting member for the IC device, a plurality of output terminals external to the package, an array of conductors connecting the said output terminals to the said output pads of the device, and a protective means. The supporting member is a wafer and the output terminals of the package are contact islands arranged on the said wafer. At least those conductors belonging to the array which are attached to the said contact islands rest on the said supporting wafer, and the protective means comprises an electrically insulating encapsulation which partly covers the supporting wafer and which leaves exposed at least the contact islands.
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