Manufacture of thinned substrate imagers
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United States of America Patent
Stats
-
May 12, 1981
Grant Date -
N/A
app pub date -
Nov 29, 1979
filing date -
Jul 25, 1979
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The front surface of a semiconductor wafer and the peripheral edge of the back surface of the wafer are protected by either coating them or by placing the wafer in a special fixture. The so protected wafer is then placed in a chemical bath and thinned to the desired thickness over the entire center region of the back surface. Then a sheet of glass which fits into the thin region within the unthinned rim on the back surface is glued to the back surface to provide a laminated structure. Next, the individual imager devices are separated from one another by cutting through the glass and thinned substrate along lines between the devices.
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