Arrangement for mounting dual-in-line packaged integrated circuits to thick/thin film circuits
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United States of America Patent
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-
Jun 9, 1981
Grant Date -
N/A
app pub date -
Dec 19, 1979
filing date -
Dec 19, 1979
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An arrangement for mounting a dual-in-line packaged integrated circuit (DIP) to a thick/thin film circuit wherein a portion of each DIP lead is formed into a U-shape including a horizontal foot portion. The arrangement further includes a complementary socket which accepts the U-shaped DIP leads in opposite sides thereof. The socket is then soldered to either a thick/thin film circuit of a circuit board.
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