Thermoelectric heat exchanger including a liquid flow circuit
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United States of America Patent
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-
Aug 4, 1981
Grant Date -
N/A
app pub date -
Mar 25, 1980
filing date -
Mar 26, 1979
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to a thermoelectric heat exchanger assembly including a liquid flow circuit. In a heat pump some of whose thermoelements (20,22) are disposed in a thermopile (P1), one of the heat exchange fluids is liquid and flows through the successive stages of the thermopile via a continuous metal tube (10) which has electrical resistance and is curved in a U configuration at each stage so as to increase the heat exchange area and to facilitate assembly. Application to domestic heating.
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