Circuit package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 4, 1981
Grant Date -
N/A
app pub date -
Sep 20, 1979
filing date -
Sep 22, 1978
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A circuit package wherein a framed resonator leaf is mounted in a recessed portion of a plastic body. The contours of the recess orient and support the resonator frame, and an electrically conductive adhesive both bonds the resonator frame to the body and electrically connects the resonator to lead electrodes embedded in the body. A circuit chip element electrically connected to the lead electrodes is also embedded in the body to provide an integral circuit package. A cover over the recess, bonded to the body, protects the resonator element. Welded connections and a resonator mounting plate are not used.
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Cited Art Landscape
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