Importance

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Abstract

A high density arrangement for interconnecting integrated circuit devices, of a type which includes a stack of numerous wafers formed primarily of metal, wherein some of the wafers holding integrated circuit chips have overhanging edge portions at one side of the stack that extend beyond other wafers of the stack, and wherein there are cooling fluid tubes clamped against the overhanging edge portions to carry away heat to a cooling fluid flowing through the tube. The wafers are interconnected at numerous locations by button portions of malleable material such as gold, and the stack of wafers are clamped together to slightly deform the button portions to provide a considerable area of contact. The stack clamping device is separate from the cooling fluid tube clamping device, to provide different degrees of pressure and compressive strain.

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First Claim