Method and apparatus for removing dice from a severed wafer
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United States of America Patent
Stats
-
Aug 25, 1981
Grant Date -
N/A
app pub date -
Dec 19, 1979
filing date -
Dec 19, 1979
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Removing dice (16) from a wafer (10) which has been attached to a tape layer (12, 14) and severed into individual die (16) leaving the tape layer (12, 14) in one piece is accomplished by attaching the tape layer (12, 14) to a length of adhesive tape (18). The adhesive tape (18) is passed across a surface (20) and through a slot (38) in the surface (20) causing the die (16) to pass across the slot (38) and away from the tape layer (12, 14) which remains attached to the adhesive tape (18).
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