Applying photoresist onto silicon wafers
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United States of America Patent
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-
Sep 1, 1981
Grant Date -
N/A
app pub date -
Jul 26, 1979
filing date -
Jul 26, 1979
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Applying photoresist to silicon wafers in the manufacture of integrated circuit chips by carrying the wafers upon a rotor in a chamber and spraying from a plurality of nozzles in the chamber toward the rotor for application to the wafers.
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