Apparatus for molding particulate expandable thermoplastic resin material using microwave heating
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United States of America Patent
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-
Nov 3, 1981
Issued Date -
N/A
app pub date -
Sep 21, 1979
filing date -
Sep 9, 1977
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Molding of expanded plastic material such as dielectric material by microwave radiation is effected in a mold in which the part of the mold which contacts the material to be molded is of a material having high dielectric losses and capable of absorbing microwave radiation. Such mold portion preferably comprises a resin containing a small amount of carbon black.
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