Multilayer via resistors
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United States of America Patent
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-
Nov 10, 1981
Grant Date -
N/A
app pub date -
Jun 2, 1980
filing date -
Jun 2, 1980
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A substrate has two or more conductive layers deposited thereon, each adjnt layer pair separated by a dielectric layer. Apertures are formed in the dielectric layer and are filled with resistor paste. In this way, a resistive path may be formed between the conductive layers. This concept of fabricating resistors are particularly useful in the inclusion of pull-up, pull-down and other non-critical resistors in the circuitry contained within a thick film construction.
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