Flat shaped semiconductor encapsulation
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 10, 1981
Issued Date -
N/A
app pub date -
Sep 25, 1980
filing date -
Sep 22, 1977
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Electrodes are formed on one major surface of a semiconductor chip and electrically connected to lead electrodes carried by a support substrate. A cover plate is fixed to the opposing major surface of the semiconductor chip to determine one major surface of semiconductor device. Remaining surfaces of the semiconductor chip are encapsulated by a resin mold. The cover plate comprises a flexible glass cloth impregnated with half cured epoxy resin.
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