Headphone construction
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United States of America Patent
Stats
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Nov 24, 1981
Grant Date -
N/A
app pub date -
Jan 4, 1980
filing date -
Jan 4, 1980
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A headphone includes a pair of ear cup assemblies attached to a headband. Each ear cup assembly includes a cushion, an earplate, a back plate and an acoustic transducer. These elements snap together and are held together by integral fasteners. Each ear cup assembly is attached to the headband by a ring-shaped yoke which is entrapped between the assembled back plate and ear plate. The result is a durable, lightweight structure which is easy to assemble on a mass production basis.
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