Molded lead frame dual in line package including a hybrid circuit
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 1, 1981
Grant Date -
N/A
app pub date -
Aug 30, 1979
filing date -
Aug 30, 1979
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A molded dual in line package is disclosed which has at least one cavity in a first major molded surface thereof into which an integrated circuit chip can be mounted and wire bonded. After the circuit is tested and adjusted, the cavity is sealed with a metal plate. Other embodiments are disclosed which include a second cavity in a second major molded surface of the package which may house or contain a second integrated circuit, an epoxy sealer, or a substrate.
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Cited Art Landscape
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