Importance

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Abstract

A feeding device for feeding wafer strip blanks to pour molds for producing coated wafer biscuits, in particular in multiple coated wafer biscuit production systems, comprising a feeding unit for wafer strips cut from an original wafer board, which feeding unit is composed of a plurality of reeds provided with means for picking up the cut wafer strips and linked to one another by means of pin elements and arranged to be movable with an accordion-like type of movement on a guiding and supporting member to reciprocate between a station where the original wafer board is cut into individual wafer strips and a station where the system pour molds are loaded into which the individual wafer strips are allowed to fall into respective seats provided in the molds. The feeding unit, in its closed position or position where the reeds lay close beside one another, has the same length as the original wafer board, and in its open position, the same length as the pour mold between the end seats of said mold. Also provided is a means operative to cause the reed assembly to open or close, as well as a means for synchronizing the reciprocating movement of the feeding unit with the mold movement.

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First Claim