Impulse jet head using etched silicon

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United States of America Patent

PATENT NO 4312008
SERIAL NO

06090552

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An improved impulse jet head structure utilizing etched silicon as the body of the structure. A silicon substrate is etched so as to form a nozzle groove, cavity, and ink supply groove. A layer of glass or other material is bonded to the top of the substrate so as to enclose the cavity and define, along with the grooves, and ink supply conduit and a nozzle conduit. A second layer of glass or other material is bonded to the bottom of the substrate and comprises the bottom surface of the cavity. A piezoelectric crystal driver is bonded to the bottom layer in a position corresponding to the location of the reservoir. An ink supply tube is bonded to the upper layer in a location above the supply groove and delivers ink to the head structure. The etching process may be utilized to form either single or multiple orifice head structures.

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Patent Owner(s)

  • DATAPRODUCTS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Taub, Howard H San Jose, CA 14 842
Wolf, Peter H Mission Viejo, CA 15 246

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