Method of manufacturing acoustic surface wave device

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United States of America Patent

PATENT NO 4314393
SERIAL NO

06133964

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Abstract

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A method of manufacturing an acoustic surface wave device comprising: forming two pairs of transducers, a multistrip coupler and lead patterns for electrically shorting at least one pair of the transducers on a piezoelectric material; mounting the piezoelectric material on a package base having pins; bonding the electrodes of the opened transducers to the pins by wires, and; testing the device by applying and obtaining signals of the opened transducers through the pins. In this manufacturing method, testing is carried out without using probing technology.

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Patent Owner(s)

  • FUJITSU LIMITED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Masaaki, Ono Kawasaki, JP 1 33
Wakatsuki, Noboru Kawasaki, JP 33 544

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