Electrically heated bonding tool for the manufacture of semiconductor devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 9, 1982
Grant Date -
N/A
app pub date -
Apr 7, 1978
filing date -
Apr 7, 1978
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A heated bonding tool for the manufacture of semiconductor devices comprises a high density non-porous alumina body having a mounting portion at one end and a working portion at the other end. The working portion end is tapered and converges toward the working tip portion. An electrically conductive-resistive thick film is deposited over the outer surface of the tapered portion intermediate said mounting portion and said working tip portion which is capable of heating said working tip of said bonding tool up to 600.degree. C. Preferably the thick film material has a positive or negative temperature coefficient of resistance which permits the temperature of the working tip to be monitored as a function of the measured resistance of the thick film. An insulative heat resistant terminal block is provided with a pair of resilient leads connected to a power source. Cam means on the terminal block are adapted to move the resilient leads to permit release of the leads from engagement with thick film conductive leads deposited on the mounting portion of the bonding tool.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully